Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra

Specifications:

• Wafer Size:5mmx5mmx0.5mm
• Silicon wafer Orientation: (100) + / - 0.5o
• Diamond film thickness:   2 micron
• Resistivity:          10E3 ~ 10E4 ohm-cm
• Surface roughness:  one sides CMP polished with surface roughness < 10 nm
• Package: One 1000 class clean room with 100 class plastic bag

MPN: FmDOS0050505FT2umUS5