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MTI Corporation

Boron Nitride Film on Silicon Wafer

Boron Nitride Film on Silicon Wafer

Boron Nitride Film Specifications:

  • BN Film coated by sputtering method
  • The amorphous structure ( no orientation)
  • Dielectric
  • BN Thickness: 24 nm +/- 10%
  • Purity: > 99.99%

Silicon Wafer Specifications:

  • Conductive type: Si n-type
  • Resistivity: 0.1-1.0 ohm-cm
  • Size: 4" diameter +/- 0.5 mm x 0.525 +/- 0.025 mm ( thickness)
  • Orientation: (100) +/- 0.5o
  • Polish: One sides polished
  • Surface roughness: Prime
  • Packing: Vacuum packed on a 4" single wafer carrier box

MPN: FmBNonSia100D0525C1FT24nm

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